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Process Flow Chart to Fabricate HDI Core Layer PCB with Plated Through Holes
    

Flowchart: Alternate Process: Circuit Schematics

Flowchart: Alternate Process: Exposure Films

Flowchart: Predefined Process: CAD Station

Flowchart: Document: PCB Design Data

Text Box: Artwork Data

Text Box: Stencil / Mask

Text Box: Solder/Legend Marking Data

Text Box: Drill Data

Text Box: Routing Data

Text Box: Visual Inspection  Data

Text Box: Laser Plotting/Patterning

Text Box: Mask/Stencil Finished

Flowchart: Alternate Process: Inner Layer Copper clad Laminates

Text Box: Photoresist Layer Apply

Text Box: Inner Layer Pattern Formation Process

　

Flowchart: Alternate Process: Outer Layer Laminates

　

Flowchart: Decision: AOI Inspection

Text Box: Developing

Text Box: Exposure

　

Text Box: Etch / Photoresist Strip

Flowchart: Decision: Inner Layer eTest  HIOKI 1116

　

Text Box: Exposure

Text Box: Flawless Inner Layers

Flowchart: Document: PCB Design Data

Text Box: Developing

Text Box: Colorless Oxidation Treatment

　

　

Text Box: Drilling

Text Box: Double Sided Copper clad Laminate

Text Box: Desmear/Conditioning

Text Box: Electroless Copper Plating Process

Text Box: Pre-Catalyzing

Text Box: Microetch/Acid Rinse

　

　

Text Box: Outer Layer Pattern Formation

Text Box: Activation/Acceleration

　

Text Box: Pattern Plating

　

Text Box: Electroless Deposition

Text Box: Layer Lamination Process

Text Box: Layer Lay Up

Text Box: Lamination Press

Text Box: SMT Data

Text Box: Electrical Test  Data

Flowchart: Decision: Coupon Tests

　

Text Box: Pattern Copper Plating / Resist Metal Layer Plating

　

　

　

Text Box: Coupon Sampling

Text Box: Routing / Cleaning

　

Flowchart: Decision: Finished PCB eTest & Final Inspections

　

　

　

　

Flowchart: Terminator: PACK & SHIP

Text Box: Solder Masks / Legend Printing

Text Box: Surface Finishing

Text Box: Developing

Text Box: Etch / Photoresist Strip

Text Box: Outer Layer Pattern Formation

Text Box: Photoresist Layer Apply

Text Box: Exposure

Text Box: Etch / Photoresist Strip

　

　

　

　

　

　

　

　

　

　

　

　

　

Disclaimers: Information in this flowchart is for reference purpose only, and HDI Solutions assumes no liability whatsoever, or warranties relating to fitness for a particular purpose.

Text Box: Panel Copper Plating

Text Box: Photoresist Layer Apply

Text Box: Prepreg

 

　

  

 

 

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