Fundamental of High Density Interconnect Board Building Technologies

Classification

    Common PCB (COREs)

• PTH-MLB: Basic Plated Through Hole (PTH) Multi-Layer Board (or CORE if solder mask layer is not applied)

                                                                Click Here for Process Flowchart

• IVH-MLB: Interstitial Via Hole (IVH) included Multi-Layer Board or Core

     Build-Up HDI PCBs

• Base + Build-Up Structure
• All Build-Up Structure I: Plated Filled Stacked Via
• All Build-Up  Structure II: Conductive Paste Filled Stacked Via
• One-Press All Layer Formation: currently under intense R&D
• HDI Rigid-Flex Structure