BF-SPIder Series

Product Classification: Automated 3D In-Line Solder Paste AOI System

Product Description: SAKI SPIder system watch the quality of solder paste imprints by measuring their individual volumes and analyze their profiles so that you can monitor quality of each image imprint and get real time feed back about any defect before too late!

Product Applications: In-line inspection right after solder paste imprinting during BGA family parts mounting.

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Product Highlights:

• Newly developed Phase Measurement Profilometer Technology ensures high inspection repeatability.
• High Speed (18sec/pass for M size area) and High Precision, 0.4 micron resolution
• Quick and Easy Setup
• Paste height and volume measurements
• Advanced analysis capability is achieved by integrating the original state-of-the-art Saki 3D measurement technology.
• 2D inspection measures solder deposition area and the base reference point for a precise height, while the 3D inspection system provides the height and volume measurement.
• Accurately detects multi-color PCBs, resists and silk prints with two types of LED illumination.
• Models selectable for inspecting PCB Sizes M or L.